Meet the Team
Sujin Philip
Staff R&D Engineer
Kitware New York
Clifton Park, NY
M.S. in Computer Science
University of Utah
B.E. in Computer Science
University of Pune
Sujin joined Kitware in November 2014 as a member of the Scientific Computing Team, working on the VTK, ParaView and VTK-m projects. As one of the core developers on the VTK-m project, his contributions include implementing parallel filters, implementing a parallel execution backend based on the Kokkos library, and integrating VTK-m filters and features in VTK and ParaView to prepare them for the new exascale supercomputers.
Sujin received his B.E. in Computer Science from the University of Pune, India, in 2006. After receiving his degree, he worked for three years at Persistent Systems, India, before joining the University of Utah for his M.S. in Computer Science with a specialization in Graphics and Visualization. At Persistent Systems, Sujin worked as a developer on the Netezza project, performing development and maintenance of the software driving Netezza’s massively parallel database appliance system.
During his master’s program, Sujin worked as a Research Assistant at the Scientific Computing and Imaging Institute, where he conducted research on distributed and hybrid parallel processing of massive images. He also completed internships at Lawrence Livermore National Laboratory and Los Alamos National Laboratory.
Awards
Best paper award presented by the Eurographics Symposium on Parallel Graphics and Visualization, 2013
Scalable Seams for Gigapixel Panoramas. By S. Philip, B. Summa, J. Tierny, P.-T. Bremer, and V. Pascucci, In Proceedings of Eurographics Symposium on Parallel Graphics and Visualization 2013, pp. 25-32
Publications
- M. Kim, J. Kress, J. Choi, N. Podhorszki, S. Klasky, M. Wolf, K. Mehta, K. Huck, B. Geveci, S. Phillip, R. Maynard, H. Guo, T. Peterka, K. Moreland, C. Chang, J. Dominski, M. Churchill, and D. Pugmire, "In Situ Analysis and Visualization of Fusion Simulations: Lessons Learned," in High Performance Computing. Springer International Publishing, 2018, pp. 230-242. [URL]